Introducing disruptive large area coating technology for the 21st century

General Plasma’s revolutionary large area Plasma Enhanced Chemical Vapor Deposition (PECVD) technology is built upon an innovative use of magnets to confine plasma.

This novel magnetic confinement method produces a dense, linear plasma making source lengths exceeding 3 meters possible. Many oxide and nitride films are enabled by this technology include: AR’s, TCO’s, solar thin films, barrier coatings and optical films.

Advantages:

• Dense plasma = High deposition rates (1µm-m/min SiO₂ deposition rate)
• Uniform plasma = Excellent uniformity
• Low impedance, low pressure discharge = No powder formation
• High flux, low energy ion bombardment = Dense, high quality films

Our processes are constantly refined at our state of the art Thin Film Development Laboratory.